ZEIT Group
Pursuing Excellence without Limits！
Add to Cart
Magnetron Sputtering Deposition in Semiconductor Industry
Applications
| Applications | Specific Purpose | Material Type |
| Semiconductor | IC, LSI electrode, wiring film | AI, Al-Si, Al-Si-Cu, Cu, Au, Pt, Pd, Ag |
| VLSI memory electrode | Mo, W, Ti | |
| Diffusion barrier film | MoSix, Wsix, TaSix,, TiSx, W, Mo, W-Ti | |
| Adhesive film | PZT(Pb-ZrO2-Ti) , Ti, W |
Working Principle
Magnetron sputtering principle: under the action of electric field, electrons collide with argon atoms in the process
of flying to the substrate at a high speed, ionizing plenty of argon ions and electrons, and then electrons fly to the
substrate. Argon ions bombard the target at a high speed under the action of electric field, sputtering lots of target
atoms,then the neutral target atoms (or molecules) deposit on the substrate to form films.
Features
| Model | MSC-SEM-X—X |
| Coating type | Various dielectric films such as metal film, metal oxide and AIN |
| Coating temperature range | Normal temperature to 500℃ |
| Coating vacuum chamber size | 700mm*750mm*700mm (Customizable) |
| Background vacuum | < 5×10-7mbar |
| Coating thickness | ≥ 10nm |
| Thickness control precision | ≤ ±3% |
| Maximum coating size | ≥ 100mm (Customizable) |
| Film thickness uniformity | ≤ ±0.5% |
| Substrate carrier | With planetary rotation mechanism |
| Target material | 4×4 inches(compatible with 4 inches and below) |
| Power supply | The power supplies such as DC, pulse, RF, IF and bias are optional |
| Process gas | Ar, N2, O2 |
| Note: Customized production available. | |
Coating Sample
Process Steps
→ Place the substrate for coating into the vacuum chamber;
→ Roughly vacuumize;
→ Turn on molecular pump, vacuumize at top speed, then turn on the revolution and rotation;
→ Heating the vacuum chamber until the temperature reaches the target;
→ Implement the constant temperature control;
→ Clean elements;
→ Revolve and back to the origin;
→ Coating film according to process requirements;
→ Lower temperature and stop the pump assembly after coating;
→ Stop working when the automatic operation is finished.
Our Advantages
We are manufacturer.
Mature process.
Reply within 24 working hours.
Our ISO Certification
Parts Of Our Patents
Parts Of Our Awards and Qualifications of R&D